The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 28, 2006
Filed:
Jan. 22, 2002
Applicants:
Chandra Venkatraman, Amherst, NY (US);
Cyndi L Brodbeck, West Seneca, NY (US);
Matthew P. Kirk, Lockport, NY (US);
Inventors:
Chandra Venkatraman, Amherst, NY (US);
Cyndi L Brodbeck, West Seneca, NY (US);
Matthew P. Kirk, Lockport, NY (US);
Assignee:
N.V. Bekaert S.A., , BE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract
The invention relatse to a copper diffusion barrier which includes a diamond-like material includes carbon, hydrogen, silicon, oxygen and a metal and is a copper diffusion barrier. Another aspect of the invention relates to an integrated circuit which includes a copper interconnect, a dielectric material and the copper diffusion barrier.
Venkatraman, Chandra. (2006). Copper diffusion barriers made of diamond-like nanocomposits doped with metals (U.S. Patent No. 7019399). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7019399
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile