The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 28, 2006
Filed:
Jul. 02, 2004
Applicants:
Takashi Sawada, Sabae, JP;
Shigekatsu Yamamoto, Takefu, JP;
Inventors:
Takashi Sawada, Sabae, JP;
Shigekatsu Yamamoto, Takefu, JP;
Assignee:
Murata Manufacturing Co., Ltd., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/04 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01);
U.S. Cl.
CPC ...
Abstract
An electronic chip component includes a component body and a plurality of terminal electrodes disposed on outer surfaces of the component body. At least one of the terminal electrodes includes a cured resin film including dispersed conductive particles, an outer conductive film formed on the cured resin film by electroplating, and additional conductive metallic particles being dispersed on an interface between the cured resin film and the outer conductive film.