The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 28, 2006
Filed:
Jun. 25, 2003
Applicants:
Jong Goo Jung, Gyeonggi-do, KR;
Sang Ick Lee, Gyeonggi-do, KR;
Inventors:
Jong Goo Jung, Gyeonggi-do, KR;
Sang Ick Lee, Gyeonggi-do, KR;
Assignee:
Hynix Semiconductor Inc., Kyoungki-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01); C09K 13/04 (2006.01);
U.S. Cl.
CPC ...
Abstract
CMP slurries for oxide film and a method for forming a metal line contact plug of a semiconductor device are described herein. When a polishing process of a multi-layer film is performed by using the disclosed CMP slurry for oxide film including an HXOcompound (wherein n is an integer from 1 to 4), a stable landing plug poly can be formed by preventing step differences by reducing interlayer polishing speed differences.
Jung, Jong. (2006). Cmp slurry compositions for oxide films and methods for forming metal line contact plugs using the same (U.S. Patent No. 7018924). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7018924
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile