The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 28, 2006
Filed:
Dec. 04, 2001
Toshiaki Takenaka, Kyoto, JP;
Toshihiro Nishii, Osaka, JP;
Yuichiro Sugita, Osaka, JP;
Shinji Nakamura, Osaka, JP;
Hideaki Komoda, Osaka, JP;
Toshikazu Kondo, Osaka, JP;
Toshiaki Takenaka, Kyoto, JP;
Toshihiro Nishii, Osaka, JP;
Yuichiro Sugita, Osaka, JP;
Shinji Nakamura, Osaka, JP;
Hideaki Komoda, Osaka, JP;
Toshikazu Kondo, Osaka, JP;
Matushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A method of manufacturing multi-layer circuit board comprising: a hole forming step for forming through-holes or blind-holes in a plate-form or sheet-form board material, and a filling step for filling a paste into through-holes or blind-holes formed in the hole forming step by using a filling means. A second paste is supplied to the paste in the filling process by using a paste supplying means to stabilized a viscosity of the paste and the paste is reliably filled into the through-holes or the blind-holes.