The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 28, 2006
Filed:
Apr. 07, 2003
Ashok Murthy, Tualatin, OR (US);
Richard Earl Corley, Jr., Lexington, KY (US);
Kris Ann Reeves, Union, KY (US);
Jeanne Marie Saldanha Singh, Lexington, KY (US);
Paul Timothy Spivey, Nicholasville, KY (US);
Ashok Murthy, Tualatin, OR (US);
Richard Earl Corley, Jr., Lexington, KY (US);
Kris Ann Reeves, Union, KY (US);
Jeanne Marie Saldanha Singh, Lexington, KY (US);
Paul Timothy Spivey, Nicholasville, KY (US);
Lexmark International, Inc., Lexington, KY (US);
Abstract
The invention relates to a method for attaching a semiconductor chip to an ink jet pen body and improved construction techniques therefor. According to the method a first adhesive have a cure time greater than about 15 minutes is dispensed in a predetermined pattern in one or more chip pockets of an ink jet pen body. Beads containing a second adhesive are dispensed in two or more discrete locations around an inside perimeter of each chip pocket. A semiconductor chip having chip edges is attached to the second adhesive in each of the chip pockets and the first adhesive is cured using heat or radiation. Use of a dual adhesive system improves the alignment of the semiconductor chips relative to one another until the first adhesive is completely cured.