The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 28, 2006
Filed:
Jun. 11, 2002
Kenichi Ikeda, Ibaraki, JP;
Toshiyuki Kawashima, Ibaraki, JP;
Nobuharu Tahara, Ibaraki, JP;
Kazuo Oouchi, Ibaraki, JP;
Kenichi Ikeda, Ibaraki, JP;
Toshiyuki Kawashima, Ibaraki, JP;
Nobuharu Tahara, Ibaraki, JP;
Kazuo Oouchi, Ibaraki, JP;
Nitto Denko Corporation, Osaka, JP;
Abstract
The present invention provides a method of manufacturing a multilayer wiring board comprising the step of impregnating a raw material composition of a thermosetting resin in a porous laminated product including two or more porous layers and a wiring layer provided between the porous layers and formed on any of the porous layers and of half curing or curing them. Moreover, the present invention provides a multilayer wiring board having such a lamination structure that two or more porous layers and a wiring layer provided between the porous layers and formed on any of the porous layers are integrated through an impregnated and cured thermosetting resin.