The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 21, 2006

Filed:

May. 21, 2001
Applicants:

Thomas Grey Beutler, Tustin, CA (US);

Raphael Rahamim, Orange, CA (US);

Inventors:

Thomas Grey Beutler, Tustin, CA (US);

Raphael Rahamim, Orange, CA (US);

Assignee:

Conexant Systems, Inc., Newport Beach, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04M 1/00 (2006.01); H04M 9/00 (2006.01); H04M 9/08 (2006.01);
U.S. Cl.
CPC ...
Abstract

A circuit board capacitor structure operable as a high voltage isolation barrier in communication circuitry. Capacitor electrodes form a capacitive structure directly on a printed circuit board's opposing sides. The PCB substrate intermediate the electrodes functions as the capacitive structure's dielectric material. The capacitor electrodes are sized such that the electrodes' area and the substrate's dielectric properties create the desired capacitance. Alternatively, a multi-layered PCB may be utilized where layer(s) is/are used to form the capacitive structure. The circuit board capacitor may couple communication circuitry located on the PCB's various sides. The circuit board capacitor operates as a high voltage isolation barrier in data access arrangements, separating line and system side circuitry. Further, the high voltage isolation barrier may include multiple circuit board capacitors to realize differential communications and/or multiple datapaths. The capacitor structure can be flexibly arranged to minimize PCB real estate and be more cost-effective than discrete capacitors.


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