The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 21, 2006

Filed:

Feb. 17, 2004
Applicants:

Seiji Hattori, Kariya, JP;

Noboru Endo, Okazaki, JP;

Inventors:

Seiji Hattori, Kariya, JP;

Noboru Endo, Okazaki, JP;

Assignee:

Denso Corporation, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 17/00 (2006.01); G01L 19/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor sensing device has a semiconductor substrate with a pressure sensing bridge circuit including piezo-resistance elements formed on the substrate. Further, the semiconductor sensing device has a temperature sensing bridge circuit including resistance elements formed on the semiconductor substrate. A pair of the resistance elements is connected with a power supply terminal, and the other pair of the resistance elements is connected with a grounding terminal. The resistance elements in either or both of these pairs are formed of different resistance types from each other and of the same conductivity type.


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