The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 2006
Filed:
Jun. 10, 2004
Applicant:
Yasuhiro Yamaji, Tsukuba, JP;
Inventor:
Yasuhiro Yamaji, Tsukuba, JP;
Assignee:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
Semiconductor chips are stacked on a first main surface of an interconnect substrate. The semiconductor chips have a base and connection bumps. Mutually facing two of the bases and the interconnect substrate are apart from each other. The connection bumps electrically connect the mutually facing two of the bases and the interconnect substrate together. Insulating sealing members seal the connection bumps and fill spaces between the mutually facing two of the base and the interconnect substrate. The sealing members have a cavity penetrating the sealing member.