The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 2006
Filed:
Jan. 02, 2002
Syamal Kumar Lahiri, Milpitas, CA (US);
Rinus Tek Po Lee, Singapore, SG;
Zuruzi Bin Abu Samah, Santa Barbara, CA (US);
Syamal Kumar Lahiri, Milpitas, CA (US);
Rinus Tek Po Lee, Singapore, SG;
Zuruzi Bin Abu Samah, Santa Barbara, CA (US);
Agency for Science, Technology and Research, Singapore, SG;
Abstract
A method of constructing an electrical contact on an electronic component comprises first forming a protruding electrically conducting stud at a contact location by wire bonding a metal wire to a contact pad of the component. The stud is then contacted with solder, without using a mask, so that a solder bump is deposited on and adheres to the metal stud to form a composite solder contact which is able to form with a contact of another component a solder joint which has good electrical and mechanical properties and which may be reliable fabricated at high density by a low cost method. An electronic component provided with such solder contacts and an electronics component package including such a component are also disclosed.