The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 2006
Filed:
Oct. 28, 2002
Haruo Wakayama, Osaka, JP;
Haruo Wakayama, Osaka, JP;
Mitsuboshi Diamond Industrial Co., Ltd., Suita, JP;
Abstract
A silicon waferincluding a plurality of semiconductor devices patterned on a top surface thereof as a result of a wafer production process is prepared. A transparent film is applied on the top surface of the semiconductor waferso as to cover all the plurality of semiconductor devices. The semiconductor wafer with the transparent film is placed on a rotatable tablesuch that a rear surface of the semiconductor wafer not covered with the transparent film is facing up away from the rotatable tableThe rear surface of the semiconductor waferis heated with a laser beam to form a laser spot, along a scribe line formation line for dividing the semiconductor wafer into a plurality of semiconductor chips, to a temperature lower than a softening point of the semiconductor wafer, while an area close to the laser spot is continuously cooled along the scribe line formation line.