The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 2006
Filed:
Feb. 09, 2004
Applicants:
Owen R. Fay, Gilbert, AZ (US);
Craig S. Amrine, Tempe, AZ (US);
Kevin R. Lish, Gilbert, AZ (US);
Inventors:
Assignee:
Freescale Semiconuctor, Inc., Austin, TX (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/50 (2006.01); H01L 21/48 (2006.01); H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
A process for encapsulating an integrated circuit die () using a porous carrier (). In one example, an adhesive structure (e.g. tape) is applied to a porous carrier. Integrated circuit die is then placed on the adhesive structure. The integrated circuit die is then encapsulated to form an encapsulated structure (). The carrier is then subjected to a solvent that passes through the carrier to reduce the adhesive strength of the adhesive structure for removal of the carrier from the encapsulated structure.