Partial wafer processing for random size wafers

Abstract

A method of processing a partial wafer in accordance with one embodiment comprises includes after of loading partial wafer into wafer table of pick and place equipment after saw; downloading wafer map data for the wafer from wafer map data host. If the partial wafer has a reference die then positioning the wafer table to the reference die and then moving the wafer table to the last column of the partial wafer. If the partial wafer does not have a reference die the last column (LCOLUMN) information is obtained from wafer map data header field in one embodiment and using LCOLUMN information remove all dies in the right side of partial wafer map. The wafer table is moved to pseudo reference die which is the first die in the bottom right. The pseudo reference die coordinate (x, y) is calculated where x=first column from right to left that has a die in the wafer map data and y=first bottom most row in the column xfrom the wafer map data. If this partial wafer is not the last partial wafer of this wafer, the wafer table is moved to the last left column (LCOLUMN) of the partial wafer. The LCOLUMN is set as complete if this is the last partial wafer and then the LCOLUMN is updated in the wafer map data header field in the original wafer map. The LCOLUMN information is used remove all dies from the wafer map data that are not part of this partial wafer. The LCOLUMN is updated in the wafer map data header field. The wafer map data file is saved for next partial wafer of the same wafer to process in the pick and place equipment and the then pick and place operation.