The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7015060 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 21, 2006

Filed:

Dec. 08, 2004
Applicants:

Randall L. Kubena, Oak Park, CA (US);

Frederic P. Stratton, Beverly Hills, CA (US);

David T. Chang, Calabasas, CA (US);

Inventors:

Randall L. Kubena, Oak Park, CA (US);

Frederic P. Stratton, Beverly Hills, CA (US);

David T. Chang, Calabasas, CA (US);

Assignee:

HRL Laboratories, LLC, Malibu, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention relates to a method of manufacturing a cloverleaf microgyroscope containing an integrated post comprising: attaching a post wafer to a resonator wafer, forming a bottom post from the post wafer being attached to the resonator wafer, preparing a base wafer with through-wafer interconnects, attaching the resonator wafer to the base wafer, wherein the bottom post fits into a post hole in the base wafer, forming a top post from the resonator wafer, wherein the bottom and top post are formed symmetrically around the same axis, and attaching a cap wafer on top of the base wafer.


Find Patent Forward Citations

Kubena, Randall. (2006). Cloverleaf microgyroscope with through-wafer interconnects and method of manufacturing a cloverleaf microgyroscope with through-wafer interconnects (U.S. Patent No. 7015060). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7015060

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