The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 21, 2006

Filed:

Sep. 22, 2003
Applicants:

Jiann-hsing Chen, Fairport, NY (US);

Joseph A. Pavlisko, Pittsford, NY (US);

Muhammed Aslam, Rochester, NY (US);

Po-jen Shih, Webster, NY (US);

Inventors:

Jiann-Hsing Chen, Fairport, NY (US);

Joseph A. Pavlisko, Pittsford, NY (US);

Muhammed Aslam, Rochester, NY (US);

Po-Jen Shih, Webster, NY (US);

Assignee:

Eastman Kodak Company, Rochester, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 1/08 (2006.01); B32B 25/02 (2006.01); B32B 25/08 (2006.01); B32B 25/20 (2006.01); G03G 15/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A fusing-station member, which member can be a compliant fuser roller or a compliant pressure roller, for use in a fusing station of an electrostatographic machine, and which member includes a base cushion layer formed on a core member, with the base cushion layer coated by a thin protective gloss control layer. In certain preferred embodiments, the base cushion layer is a highly cross-linked condensation-polymerized polyorganosiloxane material made by thermal curing of a formulation which includes three types of filler particles, namely hollow flexible microballoon particles, strength-enhancing solid particles, and thermal-conductivity-enhancing solid particles. In other preferred embodiments, expandable microspheres are included in lieu of the hollow flexible microballoon particles in an otherwise similar uncured formulation, which expandable microspheres are transformed into expanded hollow microballoon particles during the thermal curing.


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