The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 2006
Filed:
Jul. 19, 2000
Alberto Piqué, Bowie, MD (US);
Raymond Auyeung, Alexandria, VA (US);
James Fitzgerald, Laurel, MD (US);
Douglas B. Chrisey, Bowie, MD (US);
Huey-daw Wu, Fairfax, VA (US);
Paul Kydd, Lawrenceville, NJ (US);
David L. Richard, Fanwood, NJ (US);
Alberto Piqué, Bowie, MD (US);
Raymond Auyeung, Alexandria, VA (US);
James Fitzgerald, Laurel, MD (US);
Douglas B. Chrisey, Bowie, MD (US);
Huey-Daw Wu, Fairfax, VA (US);
Paul Kydd, Lawrenceville, NJ (US);
David L. Richard, Fanwood, NJ (US);
The United States of America as represented by the Secretary of the Navy, Washington, DC (US);
Abstract
A device and method for depositing a material of interest onto a receiving substrate includes a first laser and a second laser, a receiving substrate, and a target substrate. The target substrate comprises a laser transparent support having a back surface and a front surface. The front surface has a coating that comprises the source material, which is a material that can be transformed into the material of interest. The first laser can be positioned in relation to the target substrate so that a laser beam is directed through the back surface of the target substrate and through the laser-transparent support to strike the coating at a defined location with sufficient energy to remove and lift the source material from the surface of the support. The receiving substrate can be positioned in a spaced relation to the target substrate so that the source material is deposited at a defined location on the receiving substrate. The second laser is then positioned to strike the deposited source material to transform the source material into the material of interest.