The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 21, 2006

Filed:

Aug. 10, 2000
Applicants:

Nobuhiro Arimoto, Hyogo, JP;

Tadashi Ogasawara, Hyogo, JP;

Isao Uemura, Hyogo, JP;

Youji Mitani, Hyogo, JP;

Takashi Oonishi, Hyogo, JP;

Inventors:

Nobuhiro Arimoto, Hyogo, JP;

Tadashi Ogasawara, Hyogo, JP;

Isao Uemura, Hyogo, JP;

Youji Mitani, Hyogo, JP;

Takashi Oonishi, Hyogo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 14/00 (2006.01); C21D 8/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

In finifsh-cogging a high-purity titanium material into a cylindrical form as the final shape, if cylindrical cogging is performed in all stages of warm forging or if cylindrical cogging is performed in the initial stage of the warm forging, there is no need of peripherally restricting the cylindrical cogging material, so that even if longitudinal upset-forging is effected with an upsetting ratio of 2, the condition that the major diameter/minor diameter ratio of the section after forging is not more than 1.01 can be satisfied, developing superior upset-forgeability. This makes it possible, in producing disk-like targets for sputtering, to minimize cutting loss produced during the rolling and machining and to maximize the yield of products; therefore, the material can be widely used as a semiconductor material for electrodes and the like using a high-purity titanium material.


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