The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 21, 2006

Filed:

Jul. 06, 2001
Applicants:

Ronald E. Collier, Lakeville, MN (US);

Andrey Zagrebelny, Eagan, MN (US);

Inventors:

Ronald E. Collier, Lakeville, MN (US);

Andrey Zagrebelny, Eagan, MN (US);

Assignee:

Cypress Semiconductor Corp., San Jose, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B24B 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method and a system are provided for removing matter adhered to such a polishing pad. In particular, a polishing system is provided which is adapted to remove matter adhered to a polishing pad during a polishing process of a semiconductor topography. The polishing system may include a polishing pad and a spray element, which is preferably adapted to spray a pressurized fluid upon the polishing pad to remove matter adhered to the pad. In addition, a spray element is provided which may be adapted to be positioned within a polishing system. Such a spray element may be adapted to remove matter adhered to a polishing pad within the system by spraying a pressurized fluid upon the polishing pad. In addition, methods for cleaning a polishing pad during a polishing process and polishing multiple semiconductor topographies using the systems described herein are provided.


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