The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 21, 2006

Filed:

Jun. 02, 2004
Applicants:

Yoshiaki Oshima, Wakayama, JP;

Kazuhiko Nishimoto, Wakayama, JP;

Kenichi Suenaga, Wakayama, JP;

Toshiya Hagihara, Wakayama, JP;

Inventors:

Yoshiaki Oshima, Wakayama, JP;

Kazuhiko Nishimoto, Wakayama, JP;

Kenichi Suenaga, Wakayama, JP;

Toshiya Hagihara, Wakayama, JP;

Assignee:

Kao Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for manufacturing a substrate, a polishing process for a substrate, a method of reducing microwaviness for a substrate, each including the step of polishing a substrate to be polished with a polishing composition containing an abrasive and water with a polishing pad of which surface member has an average pore size of from 1 to 35 μm; and a method of reducing scratches for a substrate, comprising the step of polishing a substrate to be polished with a polishing composition comprising an abrasive, an oxidizing agent, an acid, a salt thereof, or a mixture thereof and water, with a polishing pad of which surface member has an average pore size of from 1 to 35 μm. The method for manufacturing a substrate can be used for finish polishing of a memory hard disk or for polishing of a semiconductor element.


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