The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 21, 2006

Filed:

Sep. 30, 2004
Applicants:

Hsieh-kun Lee, Tu-Cheng, TW;

Wan-lin Xia, Shenzhen, CN;

Tao LI, Shenzhen, CN;

Bo-yong Yang, Shenzhen, CN;

Inventors:

Hsieh-Kun Lee, Tu-Cheng, TW;

Wan-Lin Xia, Shenzhen, CN;

Tao Li, Shenzhen, CN;

Bo-Yong Yang, Shenzhen, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
F28D 15/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A heat dissipation device includes a first heat sink (), a second heat sink () and at least one heat pipe (). The first heat sink includes a first base () and a plurality of fins (). The second heat sink includes a second base () and a plurality of fins (). The second heat sink is located above and faced to the first heat sink. At least one fin () of the first heat sink forms a bifurcated portion () at an upper section thereof. A corresponding fin () of the second heat sink is fixed to the bifurcated portion of the bifurcated fin via soldering process. The heat pipe interconnects the first base and the second base.


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