The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 2006
Filed:
May. 30, 2002
Applicants:
Hiroshi Sakai, Tokyo, JP;
Motoji Suzuki, Tokyo, JP;
Makoto Igarashi, Niigata, JP;
Akihiro Tanaka, Niigata, JP;
Inventors:
Hiroshi Sakai, Tokyo, JP;
Motoji Suzuki, Tokyo, JP;
Makoto Igarashi, Niigata, JP;
Akihiro Tanaka, Niigata, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of packaging an electronic component having electrodes soldered on lands on a printed circuit board uses a mask pattern that corresponds to the lands onto which solder paste is deposited. Solder paste is printed on the lands using the mask which has a convex shape such that the edges of the solder paste lie inside the edges of the lands. The electrodes are then placed on the solder paste, and the solder paste is caused to reflow to solder the electrodes to the lands.