The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 2006
Filed:
Mar. 07, 2002
David H. Cox, Chatsworth, CA (US);
Bernard M. Werner, Los Angeles, CA (US);
Mary Vosse, Santa Clarita, CA (US);
David H. Cox, Chatsworth, CA (US);
Bernard M. Werner, Los Angeles, CA (US);
Mary Vosse, Santa Clarita, CA (US);
Harman International Industries, Inc., Northridge, CA (US);
Abstract
This invention provides a baffle formed from a thermoset composite material such as Bulk Molding Compound (BMC), Thick Molding Compound (TMC), or Sheet Molding Compound (SMC). Due to the physical properties of BMCs, TMCs, and SMCs, the baffle may be molded to minimize the propagation of vibrational energy and resonant mode behavior while providing high strength and rigidity. The baffle may also be formed so transducer mounts, ports and wave-guides may be molded into the baffle shape.