The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 2006
Filed:
Jul. 15, 2003
Keishi Kubo, Moriguchi, JP;
Masateru Doi, Hirakata, JP;
Hiroyuki Motizuki, Katano, JP;
Keiichi Yoshizumi, Higashiosaka, JP;
Keishi Kubo, Moriguchi, JP;
Masateru Doi, Hirakata, JP;
Hiroyuki Motizuki, Katano, JP;
Keiichi Yoshizumi, Higashiosaka, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A method for a quantitative evaluation of a substrate such as wafer defines a number of sequential first regions so that each of the first regions overlaps the adjacent region. A surface data (e.g., thickness data) in each of the first regions is used to determine a normal vector representing a surface configuration (e.g., thickness variation) of the first region. Then, an angular difference between the normal vectors is determined for each combination of adjacent two first regions. Subsequently, the determined angular difference is compared with a reference to evaluate a quality of a second region including at least one of the first regions, e.g., chip region, strip-like region and/or the entire of the wafer.