The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 2006
Filed:
Jun. 28, 2004
Satoshi Arai, Sendai, JP;
Takayuki Inoi, Sendai, JP;
Yoshihiko Saiki, Sendai, JP;
Sadamu Toita, Sendai, JP;
Satoshi Arai, Sendai, JP;
Takayuki Inoi, Sendai, JP;
Yoshihiko Saiki, Sendai, JP;
Sadamu Toita, Sendai, JP;
NEC Tokin Corp., Sendai, JP;
Abstract
An external cathode terminal () is adhered to one surface of a capacitor element while a prepreg () is adhered to another surface of the capacitor element. A reinforcement plate () is adhered to the prepreg. Heat and pressure are applied to the external cathode terminal, the prepreg, and the reinforcement plate to elute thermosetting resin from the prepreg in the side of the capacitor element, thereby sealing the side of the capacitor element with eluted material (A,B). Inasmuch as transfer molding is not used as exterior package, the element never deforms by injection pressure of resin. It is possible to thin by a thickness of exterior package resin. Inasmuch as eluted thermosetting resin does not include a mold release agent, it has good adhesion for the external cathode terminal.