The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 2006
Filed:
Apr. 09, 2003
Eiichi Takata, Nagaokakyo, JP;
Yasuji Yamamoto, Shiga-ken, JP;
Genji Inuidani, Kameoka, JP;
Michio Kadota, Kyoto, JP;
Eiichi Takata, Nagaokakyo, JP;
Yasuji Yamamoto, Shiga-ken, JP;
Genji Inuidani, Kameoka, JP;
Michio Kadota, Kyoto, JP;
Murata Manufacturing Co., Ltd., Kyoto, JP;
Abstract
A method for manufacturing an electronic component includes the steps of forming an electrode layer including α-tungsten on a substrate at a substrate temperature of about 100° C. to about 300° C. by a sputtering process, processing the electrode layer so as to have a desired shape, and heat-treating the electrode layer. An electronic component includes a substrate and an electrode layer that is disposed on the substrate directly or indirectly, includes α-tungsten, and has a specific resistance of about 15 μΩ.cm or less and a warpage of about 120 μm or less. A surface acoustic wave filter includes a piezoelectric substrate and an electrode layer, disposed on the piezoelectric substrate, including α-tungsten.