The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2006
Filed:
Jan. 13, 2005
Xiaodong Jin, Sunnyvale, CA (US);
Lawrence Tse, Fremont, CA (US);
King Chun Tsai, San Jose, CA (US);
George Chien, Cupertino, CA (US);
Shuran Wei, San Jose, CA (US);
Xiaodong Jin, Sunnyvale, CA (US);
Lawrence Tse, Fremont, CA (US);
King Chun Tsai, San Jose, CA (US);
George Chien, Cupertino, CA (US);
Shuran Wei, San Jose, CA (US);
Other;
Abstract
A circuit that eliminates an off-chip inductive component connected between an integrated circuit (IC) arranged on a package and an external load comprises a package and an IC that is arranged on the package. A first bondwire arranged on the package has one end that communicates with the external load and an opposite end that communicates with the IC. A second bondwire located on the package has one end that communicates with the external load and an opposite end that communicates with the IC.