The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2006
Filed:
Dec. 24, 2003
Kenichi Oohama, Ichinomiya, JP;
Kenichi Oohama, Ichinomiya, JP;
Denso Corporation, Kariya, JP;
Abstract
In a semiconductor device, a semiconductor module contains a semiconductor element and having a radiating portion, and a heat absorbing member has a heat absorbing portion with heat conductivity. A grease member is interposed between the radiating portion of the semiconductor module and the heat absorbing portion of the heat absorbing member. The radiating portion and absorbing portion are opposite and close to each other through the grease member in a predetermined direction. A grease extrusion path has one end and other end portions and formed in at least one of the radiating portion and the heat absorbing portion. The one end portion of the grease extrusion path is configured to contact the grease member, said other end portion thereof communicates with an exterior of the at least one of the radiating portion and the heat absorbing portion.