The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2006
Filed:
Aug. 19, 2004
Applicants:
Kevin L. Seaman, Santa Margarita, CA (US);
Vernon M. Wnek, Yorba Linda, CA (US);
Inventors:
Kevin L. Seaman, Santa Margarita, CA (US);
Vernon M. Wnek, Yorba Linda, CA (US);
Assignee:
Broadcom Corporation, Irvine, CA (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method, system, and apparatus for optimizing routing layers and board space requirements for a ball grid array package is described. The ball grid array package includes a substrate material having a first side configured to receive a semiconductor chip and a second side having a plurality of conductive pads arranged in an array of rows and columns. The array of pads has at least one edge not fully populated with pads.