The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2006
Filed:
Feb. 21, 2001
Applicants:
Jun Urakawa, Omibachiman, JP;
Mitsuyoshi Nishide, Shiga-ken, JP;
Isao Kato, Shiga-ken, JP;
Norio Yoshida, Ostu, JP;
Tomonori Ito, Shiga-ken, JP;
Inventors:
Jun Urakawa, Omibachiman, JP;
Mitsuyoshi Nishide, Shiga-ken, JP;
Isao Kato, Shiga-ken, JP;
Norio Yoshida, Ostu, JP;
Tomonori Ito, Shiga-ken, JP;
Assignee:
Murata Manufacturing Co., LTD, Kyoto, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A ceramic multi-layer wiring substrate includes a line-shaped insulation pattern arranged to extend over a plurality of surface wiring patterns and to intersect the respective surface wiring patterns, in which soldering land electrodes are defined by the insulation patterns.