The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2006
Filed:
Mar. 19, 2004
Christine Höss, Regensburg, DE;
Andreas Weimar, Regensburg, DE;
Andreas Leber, Regensburg, DE;
Alfred Lell, Maxhütte-Haidhof, DE;
Helmut Fischer, Lappersdorf, DE;
Volker Harle, Laaber, DE;
Christine Höss, Regensburg, DE;
Andreas Weimar, Regensburg, DE;
Andreas Leber, Regensburg, DE;
Alfred Lell, Maxhütte-Haidhof, DE;
Helmut Fischer, Lappersdorf, DE;
Volker Harle, Laaber, DE;
Osram Opto Semiconductors GmbH, Regensburg, DE;
Abstract
A method for fabricating at least one mesa or ridge structure in a layer or layer sequence, in which a sacrificial layer () is applied and patterned above the layer or layer sequence. A mask layer is applied and patterned above the sacrificial layer for definition of the mesa or ridge dimensions. The sacrificial layer () and of the layer or layer sequence are removed so that the mesa or ridge structure is formed in the layer or layer sequence. A part of the sacrificial layer () is selectively removed from the side areas thereof which have been uncovered in the previous step, so that a sacrificial layer remains which is narrower in comparison with a layer that has remained above the sacrificial layer as seen from the layer or layer sequence. A coating is applied at least to the sidewalls of the structure produced in the previous steps so that the side areas of the residual sacrificial layer are not completely overformed by the coating material. The sacrificial layer () is removed so that the layer that has remained above the sacrificial layer as seen from the layer or layer sequence is lifted off. A method is also disclosed for fabricating at least one gain-controlled laser diode in a layer sequence, in which method steps analogous to those described above are employed.