The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2006
Filed:
Jul. 18, 2002
Masatoshi Kato, Osaka, JP;
Akio Harada, Osaka, JP;
Masatoshi Kato, Osaka, JP;
Akio Harada, Osaka, JP;
Daiken Chemical Co., Ltd., Osaka, JP;
Abstract
By using a novel method, the exposure time of the photosensitive paste layer is reduced and the exposure fineness of the layer is improved, thereby developing a highly fine circuit substrate of high density having a thermal resistance at a reasonable cost. A circuit substrate is manufactured as follows. A photosensitive paste containing photoresist and a circuit material is applied onto a substrate surface so as to form a photosensitive paste layer (). This photosensitive paste layer () is plotted by a laser beam () so as to form a plotted area (). The photosensitive paste layer () is developed and an exposed area () or an unexposed area () is removed so as to form a circuit pattern (). This circuit pattern () is sintered to form a circuit pattern () composed of the circuit material. It is possible to form a highly fine circuit pattern of high density by laser beam plotting. Moreover, when a greensheet () is used as the substrate, it is possible to form a ceramic substrate () having a thermal resistance by sintering. Furthermore, by using this method, it is possible to form an arbitrary image on an arbitrary object.