The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2006
Filed:
Sep. 12, 2001
Applicant:
Yoshihito Fukushima, Miyagi, JP;
Inventor:
Yoshihito Fukushima, Miyagi, JP;
Assignee:
Sony Corporation, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B29D 11/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
Preventing a molded disc substrate from generating a separation pattern. To this end, a molding dieincludes a pair of stationary dieand movable dieand an outer circumference ringfor molding an outer circumference end of the disc substrateThe outer circumference ringis so mounted as to be movable along forward and backward directions in parallel with a moving direction of the movable dietoward the stationary dieand has a retaining surfacefor retaining the outer circumference of the molded disc substrate
Quick Actions:
Fukushima, Yoshihito. (2006). Molding die apparatus, method for molding disc substrate, and disc-shaped recording medium (U.S. Patent No. 7008216). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7008216
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile