The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 07, 2006

Filed:

Mar. 10, 2003
Applicants:

Makoto Komatsubara, Ibaraki, JP;

Yasuhito Ohwaki, Ibaraki, JP;

Takeshi Yoshimi, Ibaraki, JP;

Shigenori Morita, Ibaraki, JP;

Inventors:

Makoto Komatsubara, Ibaraki, JP;

Yasuhito Ohwaki, Ibaraki, JP;

Takeshi Yoshimi, Ibaraki, JP;

Shigenori Morita, Ibaraki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides a production method of a printed circuit board having a circuit pattern with a little variation in the thickness at a low cost without a special step for removal of a dummy pattern. The present invention is characterized in that an insulating layeris formed in a given pattern on one surface of a supporting substrate, a circuit patternis formed on the insulating layerwhile forming a dummy patternin an area free of the insulating layeron the one surface of the supporting substrate, and an unnecessary part of the supporting substrate, which is free of the insulating layerand the circuit pattern, is removed by dissolution together with the dummy pattern


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