The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2006
Filed:
May. 30, 2002
Stefan Kaufmann, Aarau, CH;
Thomas Lang, Bubikon, CH;
Egon Herr, Zürich, CH;
Mauro Nicola, Lenzburg, CH;
Soto Gekenidis, Gränichen, CH;
Stefan Kaufmann, Aarau, CH;
Thomas Lang, Bubikon, CH;
Egon Herr, Zürich, CH;
Mauro Nicola, Lenzburg, CH;
Soto Gekenidis, Gränichen, CH;
ABB Schweiz AG, Baden, CH;
Abstract
The stackable power semiconductor module comprises electrically conductive base plates, an electrically conductive cover plate and a plurality of semiconductor chips. The semiconductor chips are arranged in groups of several on separate base plates in preassembled submodules. The base plates are moveable towards the cover plate. The submodules are paralleled inside the module housing. The submodules are fully testable according to their current ratings. Altering the number of submodules paralleled inside the housing can vary the overall current rating of a module.