The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2006

Filed:

Oct. 04, 2001
Applicants:

Christl Lauterbach, Höhenkirchen-Siegertsbrunn, DE;

Christian Paulus, Weilheim, DE;

Inventors:

Christl Lauterbach, Höhenkirchen-Siegertsbrunn, DE;

Christian Paulus, Weilheim, DE;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/20 (2006.01); H01L 21/4763 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for fabricating a microelectronic circuit having an improved electrically conductive element. The method includes providing a finished processed microelectronic circuit having a monolithically integrated coil and having a passivation layer situated above at least the monolithically integrated coil. The method further comprises removing at least part of the passivation layer above the monolithically integrated coil and applying a metal layer above the monolithically integrated coil so that the metal layer is electrically coupled to the monolithically integrated coil.


Find Patent Forward Citations

Lauterbach, Christl. (2006). Method for fabricating a microelectronic circuit including applying metal over and thickening the integrated coil to increase conductivity (U.S. Patent No. 7005360). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7005360

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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