The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2006
Filed:
Jun. 16, 2005
Applicants:
Hiroshi Ogasawara, Kanagawa, JP;
Hideyuki Kurita, Kanagawa, JP;
Inventors:
Hiroshi Ogasawara, Kanagawa, JP;
Hideyuki Kurita, Kanagawa, JP;
Assignee:
RFStream Corporation, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
Abstract
Some embodiments of the invention cover the top of a flip chip IC with a conductive adhesive material. This material is used in place of a shielding metal can or plate in some embodiments, while it is used in conjunction with such metal can or plate in other embodiments of the invention. Also, some embodiments use a printing technique to coat the top of the flip chip with the conductive adhesive material. In some embodiments, the coating material is a silver paste.