The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2006

Filed:

Feb. 05, 2004
Applicants:

Minoru Murata, Obu, JP;

Toshiya Ikezawa, Kariya, JP;

Tetsuro Yano, Handa, JP;

Inventors:

Minoru Murata, Obu, JP;

Toshiya Ikezawa, Kariya, JP;

Tetsuro Yano, Handa, JP;

Assignee:

Denso Corporation, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/58 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor dynamic sensor has a displacement portion, which is composed of a movable electrode and first and second fixed electrodes, formed in a semiconductor substrate. The movable electrode is displaced in response to applied acceleration, so that capacitance between the movable electrode and each of the first and second fixed electrodes changes. Therefore, the applied acceleration can be detected based on the capacitance change. A plurality of rectangular-shaped suction portions is provided at four corners on the surface of the semiconductor substrate. By sucking the suction portions using a collet check, the semiconductor dynamic sensor such can be transported without damaging the displacement portion.


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