The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2006
Filed:
Nov. 27, 2002
Wei (Helen) LI, Puyallup, WA (US);
Kishio Miwa, Shiga, JP;
Wei (Helen) Li, Puyallup, WA (US);
Kishio Miwa, Shiga, JP;
Toray Composites (America), Inc., Tacoma, WA (US);
Abstract
An epoxy composition includes an epoxy resin, a latent curing agent, and a catalyst. The composition includes two epoxide groups per molecule, and the latent curing agent is preferably a dicyanopolyamide, and most preferably dicyandiamide. The catalyst includes 2,4-toluene bis dimethyl urea, preferably in a concentration exceeding 70% by weight. The composition can be used in prepregs. The relative concentrations of the epoxy resin, curing agent, and catalyst are selected to achieve desired properties, including specific curing times and temperatures, and glass transition temperatures that enable a cured resin composition to be removed from a mold after being heated to its curing temperature, without being cooled. Exemplary formulations have reduced cure times, at both high and low curing temperatures, as compared to prior art formulations.