The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7005081 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 28, 2006

Filed:

Jul. 03, 2002
Applicants:

Nobuo Kawase, Kanagawa, JP;

Masakatsu Ohta, Tokyo, JP;

Nobuyoshi Tanaka, Tokyo, JP;

Inventors:

Nobuo Kawase, Kanagawa, JP;

Masakatsu Ohta, Tokyo, JP;

Nobuyoshi Tanaka, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

This invention discloses an ingot cutting apparatus, wherein a crystalline ingot is positioned within an etching gas and a component of the etching gas is excited by illumination of light from a light source onto the crystalline ingot, thereby making a component of the etching gas react chemically with the component of the crystalline ingot and volatilizing the component of the crystalline ingot to cut the crystalline ingot and obtain wafers and wherein light from a light source is guided to the crystalline ingot via a sheet-like, bar-like, or fiber-like optical wave guide.


Find Patent Forward Citations

Kawase, Nobuo. (2006). Base material cutting method, base material cutting apparatus, ingot cutting method, ingot cutting apparatus and wafer producing method (U.S. Patent No. 7005081). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7005081

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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