The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7004747 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 28, 2006

Filed:

May. 15, 2003
Applicant:

Ikuo Asai, Aichi-ken, JP;

Inventor:

Ikuo Asai, Aichi-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29D 11/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The transfer plate is energized and heated uniformly in the state in which the transfer plate heated through the electric resistance heating is separated slightly from the specular surface of the specular plate, then, immediately before the die is closed, the transfer plate is pressed against the specular surface to adhere thereto and, at the same time, the resin material is supplied to the cavity quickly and, after that, at the same time as the molded product is shaped completely, the transfer plate is de-energized so that the resin material in the cavity is quenched at the controlled temperature of the specular plate that is set to be lower than the heating temperature of the transfer plate.


Find Patent Forward Citations

Asai, Ikuo. (2006). Molding die and molding method (U.S. Patent No. 7004747). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7004747

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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