The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2006
Filed:
Oct. 31, 2002
Eduard Bergmann, Ludenscheid, DE;
Herwig Rilling, Kamen, DE;
Peter Westermayr, Bonn, DE;
Clemens Hofbauer, Teuhlitz, DE;
Boris Klebensberger, Karlsbad, DE;
Karsten Wambach, Bräunsdorf, DE;
Eduard Bergmann, Ludenscheid, DE;
Herwig Rilling, Kamen, DE;
Peter Westermayr, Bonn, DE;
Clemens Hofbauer, Teuhlitz, DE;
Boris Klebensberger, Karlsbad, DE;
Karsten Wambach, Bräunsdorf, DE;
Leopold Kostal GmbH & Co. KG, Ludenscheid, DE;
Solarworld AG, Bonn, DE;
Abstract
An arrangement which has a panel-like electrical/electronic module, such as a solar power module, and a connection unit which are electrically connected to one another. The module and the connection unit each have an essentially flat printed conductor structure with connecting sections. The printed conductor structures are situated in parallel planes. The connecting sections are rigid electrical conductor sections and are bent out from the planes of the printed conductor structures of the connection unit and the module. The connecting sections of the connection unit are situated corresponding to the arrangement of the connecting sections of the module so that for the connection unit connected to the module each connecting section of the module is electrically connected to a respective connecting section of the connection unit and these adjoin one another in one section situated in a different spatial position than that of the planes of the printed conductor structures.