The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2006
Filed:
Dec. 19, 2002
Jianxin Zhu, Eagan, MN (US);
Lance Eugene Stover, Eden Prairie, MN (US);
Gordon Merle Jones, Eagan, MN (US);
Jianxin Zhu, Eagan, MN (US);
Lance Eugene Stover, Eden Prairie, MN (US);
Gordon Merle Jones, Eagan, MN (US);
Seagate Technology LLC, Scotts Valley, CA (US);
Abstract
A bond pad is elevated from a slider body by a conductive post. The bond pad is disposed atop the post, which typically possesses a cross-sectional area smaller than the surface are of the bond pad. Thus, rather than having the entire surface of the bond pad in contact with the slider body, only the cross-sectional area of the conductive post is in contact therewith. Alternatively, a bond pad may be split into two electrically coupled pads: one pad used for housing a permanent bond, and a second pad used for housing a temporary bond. The pad used to house the temporary wire bond may be disposed atop a sacrificial layer. After a lapping process, the sacrificial layer may be etched away, thereby permitting the temporary pad to be removed.