The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2006

Filed:

Jun. 28, 2002
Applicants:

John Erik Lindholm, Cupertino, CA (US);

Simon Moy, Mountain View, CA (US);

Kevin Dawallu, Sunnyvale, CA (US);

Mingjian Yang, Sunnyvale, CA (US);

John Montrym, Los Altos, CA (US);

David B. Kirk, San Francisco, CA (US);

Paolo E. Sabella, Pleasanton, CA (US);

Matthew N. Papakipos, Palo Alto, CA (US);

Douglas A. Voorhies, Menlo Park, CA (US);

Nicholas J. Foskett, Mountain View, CA (US);

Inventors:

John Erik Lindholm, Cupertino, CA (US);

Simon Moy, Mountain View, CA (US);

Kevin Dawallu, Sunnyvale, CA (US);

Mingjian Yang, Sunnyvale, CA (US);

John Montrym, Los Altos, CA (US);

David B. Kirk, San Francisco, CA (US);

Paolo E. Sabella, Pleasanton, CA (US);

Matthew N. Papakipos, Palo Alto, CA (US);

Douglas A. Voorhies, Menlo Park, CA (US);

Nicholas J. Foskett, Mountain View, CA (US);

Assignee:

NVIDIA Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06T 17/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A graphics pipeline system and associated method are provided with an integrated clipping operation. First included is a transform module positioned on a single semiconductor platform for transforming graphics data from a first space to a second space. Also provided is a lighting module positioned on the same single semiconductor platform as the transform module. The lighting module is adapted for performing lighting operations on the graphics data. A clipping operation is also performed utilizing the single semiconductor platform.


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