The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2006

Filed:

Apr. 25, 2005
Applicants:

Tomokazu Ito, Tokyo, JP;

Takashi Kudo, Tokyo, JP;

Makoto Otomo, Tokyo, JP;

Inventors:

Tomokazu Ito, Tokyo, JP;

Takashi Kudo, Tokyo, JP;

Makoto Otomo, Tokyo, JP;

Assignee:

TDK Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention relates to surface-mount coil component including a mount surface mounted on a printed circuit board or a hybrid IC (HIC), and provides a small and low-profile coil component excellent in impedance characteristic. The coil component includes coil conductors each of which includes a major wiring region having the number N of wiring lines and a minor wiring region arranged to be opposite to the major wiring region and having the number (N−1) of wiring lines, and is arranged so that a major wiring side interval as an interval between an outermost periphery of the major wiring region and one side part of the substrate opposite thereto is longer than a minor wiring side interval as an interval between an outermost periphery of the minor wiring region and the other side part of the substrate opposite thereto.


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