The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2006

Filed:

Jan. 20, 2004
Applicants:

Inao Toyoda, Anjo, JP;

Teruo Oda, Gamagori, JP;

Seiichirou Otake, Hazu-gun, JP;

Hiroaki Tanaka, Kariya, JP;

Inventors:

Inao Toyoda, Anjo, JP;

Teruo Oda, Gamagori, JP;

Seiichirou Otake, Hazu-gun, JP;

Hiroaki Tanaka, Kariya, JP;

Assignee:

Denso Corporation, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/84 (2006.01);
U.S. Cl.
CPC ...
Abstract

A pressure detecting device includes a semiconductor substrate () for outputting an electrical signal corresponding to an applied pressure received from a pressure transmitting member () having electrically conductive properties disposed on the front surface of the semiconductor substrate (). The substrate () and the pressure transmitting member () are accommodated in a housing (). A lead member () electrically independent of the housing () is accommodated in the housing () at the back surface side of the semiconductor substrate (), and the lead member () and an electrode () of the substrate () are electrically connected to each other through conductive adhesive material (). The housing () preferably includes a first portion (), a second portion () having smaller thermal conductivity than the first portion, and an electrically conductive partition portion ().


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