The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2006
Filed:
Jun. 12, 2002
Kazumasa Iida, Morioka, JP;
Junko Yoshioka, Morioka, JP;
Naomichi Sakai, Matsudo, JP;
Masato Murakami, Tokyo, JP;
Kazumasa Iida, Morioka, JP;
Junko Yoshioka, Morioka, JP;
Naomichi Sakai, Matsudo, JP;
Masato Murakami, Tokyo, JP;
Abstract
The present invention provides a method for joining an RE123 oxide superconductor matrix obtained by a melt process by the use of a solder material. The (110) plane of an RE123 oxide superconductor matrix obtained by a melt process is used as the plane to be joined, a solder material composed of an RE123 oxide superconductor having a lower melting point than the above-mentioned RE123 oxide superconductor is interposed between the planes to be joined, and this solder material is melted and then solidified to form a joining layer, thereby joining the matrices. The solder material can be a sinter, a melt-processed material, a powder, a slurry, or a molded powder.