The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2006
Filed:
Jul. 02, 2001
Applicants:
Minoru Adachi, Nara, JP;
Shoji Uesugi, Ikoma, JP;
Inventors:
Minoru Adachi, Nara, JP;
Shoji Uesugi, Ikoma, JP;
Assignee:
Cluster Technology Co., Ltd., , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B28B 5/00 (2006.01); C08L 61/26 (2006.01); C08L 63/04 (2006.01);
U.S. Cl.
CPC ...
Abstract
The present invention provides a resin composition suitable for molding a microscopic structure that has small cure shrinkage, good mold transfer properties and excellent properties for post-processing such as polishing processing and laser processing. Such a resin is a thermosetting resin composition comprising 95 to 35 wt % of a thermosetting resin and 5 to 65 wt % of organic filler having a particle size of 10 μm or less. From such a resin, an ink ejecting apparatus having a microscopic structure, for example, a nozzle of a diameter of 30 μm, is integrally molded.