The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2006

Filed:

Jun. 13, 2001
Applicants:

Kazuhiko Oda, Chuo-ku, JP;

Tetuji Maruno, Chuo-ku, JP;

Kouji Tanaka, Chuo-ku, JP;

Akira Sasaki, Chuo-ku, JP;

Inventors:

Kazuhiko Oda, Chuo-ku, JP;

Tetuji Maruno, Chuo-ku, JP;

Kouji Tanaka, Chuo-ku, JP;

Akira Sasaki, Chuo-ku, JP;

Assignee:

TDK Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/22 (2006.01);
U.S. Cl.
CPC ...
Abstract

A composite substance for forming a conductive paste, comprises a solvent being compatible with an organic component included in the conductive paste, and metal particles wetted by the solvent. The conductive paste comprises an organic binder, the composite substance and an organic solvent mixed with the organic binder and the composite substance. The method for manufacturing the composite substance comprises the step of adding the solvent to undried metal particles having been washed with water, the solvent being compatible with the organic binder included in the conductive paste and incompatible with water so that the water is replaced by the solvent. The method for manufacturing the conductive paste comprises the step of mixing an organic binder and an organic solvent with the composite substance.


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