The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2006

Filed:

Jan. 18, 2002
Applicants:

Mike Ming Yu Chen, Daly City, CA (US);

Thomas Edward Dinan, San Jose, CA (US);

April Hixson-goldsmith, Campbell, CA (US);

Murali Ramasubramanian, San Jose, CA (US);

Neil Leslie Robertson, Palo Alto, CA (US);

Inventors:

Mike Ming Yu Chen, Daly City, CA (US);

Thomas Edward Dinan, San Jose, CA (US);

April Hixson-Goldsmith, Campbell, CA (US);

Murali Ramasubramanian, San Jose, CA (US);

Neil Leslie Robertson, Palo Alto, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C25D 5/50 (2006.01);
U.S. Cl.
CPC ...
Abstract

A process for electroplating and annealing thin-films of nickel-iron alloys having from 63% to 81% iron content by weight to produce pole pieces having saturation flux density (B) in the range from 1.9 to 2.3 T (19 to 23 kG) with acceptable magnetic anisotropy and magnetostriction and a coercivity (H) no higher than 160 A/m (2 Oe). The desired alloy layer properties, including small crystal size and minimal impurity inclusions, can be produced by including higher relative levels of Feions in the electroplating bath while holding the bath at a lower temperature while plating from a suitable seed layer. The resulting alloy layer adopts a small crystal size (BCC) without significant inclusion of impurities, which advantageously permits annealing to an acceptable Hwhile retaining the high Bdesired.


Find Patent Forward Citations

Chen, Mike Ming Yu. (2006). Method for electroplating a body-centered cubic nickel-iron alloy thin film with a high saturation flux density (U.S. Patent No. 7001499). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7001499

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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