The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7001190 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 21, 2006

Filed:

Apr. 26, 2004
Applicants:

Francis P. Morana, Mechanicsburg, PA (US);

David S. Szczesny, Hershey, PA (US);

Inventors:

Francis P. Morana, Mechanicsburg, PA (US);

David S. Szczesny, Hershey, PA (US);

Assignee:

Tyco Electronics Corporation, Middletown, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/00 (2006.01); H05K 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An electrical contact for a ball grid array connector includes a platform for holding a solder ball and a body having a first end frictionally coupled to the platform and an opposite second end that includes a separable interface configured to mate with a mating contact. The body is separable from the platform when the platform is mounted to a circuit board.


Find Patent Forward Citations

Morana, Francis. (2006). Repairable ball grid array contact (U.S. Patent No. 7001190). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7001190

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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